Plasma sputtering

A process in which energetic particles from a gas plasma bombard a solid target material, dislodging (sputtering) its atoms. These ejected atoms then deposit onto a substrate, forming an ultra-thin layer. This is a type of physical vapor deposition (PVD) used to create coatings and thin films for various applications, including semiconductor manufacturing, optical devices, and wear-resistant surfaces.

4 chambers for plasma sputtering (DC, RF, and AC)

• Plasma functionalization
• Thin film deposition 

PECVD deposition 

PECVD (plasma-enhanced chemical vapor deposition) is a thin film deposition technique that uses plasma energy to activate gaseous precursors, causing them to react and form a solid film on a substrate. The main advantage of PECVD is that it operates at lower temperatures than conventional CVD, allowing high-quality films to be deposited on temperature-sensitive materials and creating various insulating, protective, and electronic layers in the fields of microelectronics, optics, and packaging.

4 chamber for PECVD deposition and functionalization 

• Powder processing